K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging.Tin: 99.3%, Silver : 0%, Copper: 0.7% Contains Nickel and Bismuth Melt Point: ~227° C
Trustpilot
3 days ago
2 days ago
